Equipment features

1. Using short pulse nanosecond ultraviolet laser to better reduce deposition and thermal effects

And with low burrs, it greatly improves the cutting quality.
2. Unique light control software technology, variable cutting groove width, and can correspond to
200um thick wafer products with full cutting function for more flexible applications
Convenient.
3. Equipped with a dual CCD vision system and a 380 degree rotating motor,
High speed image recognition capability, automatic image recognition, edge recognition
Cut inspection, automatic correction of cutting line position, visual recognition processing.
4. Real time monitoring and feedback of laser power to ensure more stable laser power output.
5. Mobile repeatability accuracy (≤± 1um).
6. Double coating and cleaning system to improve equipment processing efficiency.